07 December 2015

Samsung allegedly looking for internal heat pipesupplier for the Galaxy S7

A few months back, when Qualcomm was not fully reveal the Snapdragon 820 it was rumored that the new chipset was also from overheating quickly to shoot problems as its predecessor which was 810,Qualcomm Snapdragon those rumors and said that the Snapdragon 820 from well within the parameters. Yet it remains a problem for those, which never fully joined Qualcomm the word, that the Snapdragon 810had no problems with overheating, although sufficient evidence, the results do not support it.

A new report from Asia claims that ensure that the Snapdragon 820 do not cause such problems for the Galaxy S7 Samsung searches now internal heat pipe supplier for the next flagship handset. The company is apparently with several different types and forms of heat pipes experiments, it will decide on the basis of these experiments whether or not, include a heat pipe in the Galaxy S7 for heat dissipation purposes. This method was already in devices for this same purpose, the OnePlus 2 and the Sony Xperia Z5 premium has been used, it is really is not anything ground breaking if Samsung chooses to do the same with the GalaxyS7. We exclusively confirmed a few months back, that Samsung will be two models of the Galaxy S7 with variants of both the Exynos 8890 or 820 Snapdragon processor on the market powered to release.

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